In the exposure process, after the surface of the silicon wafer and the quartz mask are aligned and focused, ultraviolet light is used to irradiate Harmonic joint shaft drive FHA-25C-100-E250-C photoresist in the part not covered by the mask to expose the photoresist, and the circuit diagram is transferred from the mask to the silicon wafer.
5) Development
Lithography schematic
A chemical developer is used to dissolve the photorHarmonic joint shaft drive FHA-25C-100-E250-C esist soluble areas caused by exposure, so that visible patterns appear on the silicon wafer, and distinguish the areas that need to be etched and the areas protected by the photoresist. After the development is completed, spin off the excess developer solution, rinse with high-purity water, and spin dry.
Schematic diagram of development process
6) Hard film
The thermal baking after development is called hard film baking, and the temperature is higher than soft baking. The purpose is to evaporate the remaining solvent to make the photoresist hard and improve the adhesion of the photoresist toHarmonic joint shaft drive FHA-25C-100-E250-C the surface of the silicon wafer. The stability of the glue is very critical for the subsequent etching and other processes