Lithography is divided into two basic processes: positive lithography and negative lithography. The difference lies in the type of photoresist used in the two. Robot harmonic gear FHA-25C-160-E250-CThe photoresist used in negative photolithography will become insoluble after exposure due to cross-linking, and will harden, and will not be washed away by the solvent, so that this part of the silicon wafer will not be etched Robot harmonic gear FHA-25C-160-E250-C away in the subsequent process. The pattern on the photoresist is opposite to the pattern on the reticle. The process of building semiconductor devices on the surface of silicon wafers Positive lithography is opposite to negative lithography. The photoresist in the exposed part will be destroyed and washed away by the solvent. Robot harmonic gear FHA-25C-160-E250-CThe silicon wafer in this part will be etched away without photoresist protection. The graphics are the same as those on the reticle.