When the silicon wafer is stationary or rotating very slowly, the photoresist is dropped on the silicon wafer. Then accelerate the rotation of the Motor direct-coupled harmonic drive FHA-25C-160-E250-Csilicon wafer to a certain speed, the photoresist stretches to the entire surface of the silicon wafer by centrifugal action, and continues to rotate to shake off the excess photoresist to obtain a uniform photoresist filmMotor direct-coupled harmonic drive FHA-25C-160-E250-C covering layer on the silicon wafer. It stops until the solvent evaporates and the photoresist film is almost dried. Glue equipment 3) Soft baking After the photoresist is applied, the silicon wafer needs to be soft-baked to remove the residual solvent in the photoresist and improve the adhesion and uniformity of the Motor direct-coupled harmonic drive FHA-25C-160-E250-Cphotoresist. The photoresist that has not been soft-baked is easy to be sticky and contaminated by particles, and the adhesion will be insufficient. Also, due to the high solvent content, there will be differences in dissolution during development, and it is difficult to distinguish between exposed and unexposed photoresists.